Full-Service BGA Assembly – Sourcing to Shipping
Overview
Full-service BGA assembly from component sourcing through final shipping—all managed by one team, all under one roof. Studio Electronics offers Full-Service BGA Assembly covering the complete production cycle. As a comprehensive provider of PCB assembly in China, we manage component procurement, PCB fabrication, SMT assembly, specialized BGA process control, 100% X-Ray inspection, and global logistics. Our 12 automated SMT lines and advanced inspection systems deliver reliable BGA assemblies with complete documentation and traceability.
Full-Service BGA Coverage – Sourcing to Shipping
| Service Area |
Studio Capability |
Quality Assurance |
| Component Sourcing |
Global supply chain; authorized distributors |
Incoming inspection; LCR testing; traceability |
| PCB Fabrication |
In-house or customer-provided |
Material certification; controlled processes |
| SMT Assembly |
12 automated SMT lines; ±25μm accuracy |
SPI; AOI; real-time monitoring |
| BGA Placement |
All BGA types; vision alignment |
±25μm accuracy; optimized parameters |
| Controlled Reflow |
Custom profiles per BGA; nitrogen option |
Profile validation; thermal monitoring |
| X-Ray Inspection |
2D and 3D X-Ray—100% coverage |
Void analysis; automated void calculation |
| Testing |
ICT; Flying Probe; FCT—100% coverage |
Documented results per board serial number |
| Logistics |
Anti-static packaging; customs clearance |
Packaging verification; tracking; delivery |
Our Full-Service BGA Assembly Process
Stage 1: Component Sourcing – Components sourced through authorized distributors. For low volume PCB assembly, small-quantity procurement supported.
Stage 2: PCB Fabrication – In-house PCB fabrication or customer-provided boards.
Stage 3: Engineering Optimization – BGA design review; reflow profile optimization; stencil design.
Stage 4: SMT & BGA Assembly – 12 SMT lines with ±25μm accuracy. BGA placement with vision alignment. Controlled reflow. Nitrogen reflow available.
Stage 5: X-Ray Inspection – 100% coverage; 2D and 3D X-Ray; void analysis; automated void calculation. Inspection results per board serial number.
Stage 6: Testing & Final Assembly – ICT; Flying Probe; FCT. Careful handling; anti-static packaging; customs clearance; global shipping.
Why Full-Service BGA Assembly Matters
-
Complete Accountability – One supplier owns the entire process
-
Reduced Burden – No need to coordinate multiple vendors
-
Consistent Quality – Unified quality management across all stages
-
Faster Results – Integrated production with no handoff delays
-
Simplified Logistics – One shipment; one invoice; one point of contact
Studio delivers Full-Service BGA Assembly—sourcing to shipping with 100% X-Ray verification on every BGA board
